Diffusion Bonding (DB)


Some of the main benefits of the combination of diffusion bonding and HIP techniques are the following:

  • Solid state joining, as an alternative to welding, which has problems with heat affected zones (HAT) and defects
  • Seamless diffusion of similar and/or dissimilar materials with different melting temperatures
  • Cost savings due to targeted application of the material with specific properties.
  • A wide range of material combinations is possible, in many cases avoiding the application of interlayers (buttering).


Typical examples of HIP and diffusion bonding combinations:

This technique is used to create complex shapes for the electronics, aerospace and nuclear industries for parts such as fuselages, actuator accessories, landing gear trunnions, gondola frames and nuclear control rods.

Materials that can typically be used for diffusion bonding and HIP are composites; hard facing materials; brazing and soldering, materials; super alloys; stainless steels, corrosion resistant materials, and titanium and aluminum alloys.